Hello guys..I really have a hard time understanding these two terms and there application in the industry..please give me some hand with the there basic principle..
I will be applying them with my process handled..
Hello guys...I have a difficulty in determining the factors that greatly affect the rate of oxidation of Copper, Gold and Aluminum.
On the other hand i know that of the three elements, Aluminum has the highest tendency to oxidize,2nd is Copper and third is Gold basing on their Electronegativity.
I am a new engineer in a Semicon Industry and i handle Wirebond technology..I would like to ask why it is hard to wirebond Gold wire to copper Leadframe..Is there any property between Gold and copper that affects there compatibility?
