hi erveryone..
i find difficulty to do my simulation by using Ansys Workbench. The problem is i know that the epoxy encapsulant for a high power LED will capture small amount(known amount) of heat. In my simulation, i dono how to apply this condition in.
What should i do?
thanks
For high power LED, why the temperature of silicone can reach around 200 degree C although the die temperature only around 100++ degree C?
where can i find related journal regrading to the Q?