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Solid-state thermal-interface bondline: Silicon bonded directly to aluminum
What design and cost advantages could be gained, in what applications, with the bonding of silicon wafer -- the heat source in power devices -- directly to aluminum -- the heat sink..? Despite the massive CTE-mismatch, we've shown that this Si-on-Al laminaion is possible, with the bondline...- TPI_bondline
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- Forum: Power supply & electronic component design
