For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes.

This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT).

This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs.

This white paper is sponsored by Mentor Graphics. To download your copy please fill out the form on this page.