White Paper - Fabless Challenges of Integrating Complex Silicon into the IC Package, Even the System PCB
As the world demands higher performance, higher bandwidth, and greater capacity from smaller, lighter, and lower-power products, high-density advanced packaging (HDAP) becomes a design necessity. Learn what's required to build a true, multi-substrate flow for emerging HDAP design requirements.
To download, please complete the form on this page. Your download is sponsored by Mentor, a Siemens Business.
Get Your Resource
Please provide the following to access your download.