White Paper - Getting Started with Critical Area Analysis
Critical area analysis (CAA) can be used by both designers and foundries to directly improve the manufacturability, and ultimately the profitability, of IC designs. In this white paper we introduce the concept of defect density data for critical area analysis and how it can impact yield.
Learn more about how to:
Identify design geometries susceptible to random defects during manufacturing
Adjust the manufacturing processes to reduce the occurrence of random defects for given geometries
Generate defect density data from test chips
Predict defect limited yield before tapeout
To download, please complete the form on this page. Your download is sponsored by Mentor, a Siemens Business.
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