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Recent content by Zorp
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Gold Embrittlement in solder joints
I am a certified IPC-A-610C Class A Instructor. IPC/EIA J-STD - 001 C (the end item standard that 610C is inspecting to) states: 5.4.1 Gold Removal: Gold shall be removed from solder terminals plated with 2.5 um [0.0984 mil] or greater gold thickness. Before soldering to any gold plated...- Zorp
- Post #6
- Forum: Circuit design
