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Recent content by tinchi
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Nickel Tungsten Compound in CCD die attachment
I am doing an analysis on mobile phone camera. The camera structure is that a CCD is attached on a silicon substrate while the Si substrate is attached to the Aluminum Oxide cage with the layers of Epoxy-silicon resin, Gold, Nickel, Nickel 4 Tungsten compound and Tungsten as shown in the...- tinchi
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- Forum: Material engineering general discussion
