Sorry, I meant heat evolution takes place within the interconnect, not inside the junction or the ceramic substrate.
The internal design of each diode prevents return flow, but the heat evolves into a hot carrier electron or hot carrier hole at the interconnect as it begins to traverse the...
You wouldn't see a temperature gradient in a powered version of this device?
I understood that the evolution of heat took place at the junction interconnects, not really inside the junction itself.
As for the hot and cold surfaces, they're still there, just dealing with hot and cold edges now...
Hello,
I'm new to this board, but I'd like to get some verification on an idea I'm working on.
In 2001, Eneco, a company owned and operated by Professors at MIT, delivered their "Power Chip", a semiconductor structure that delivers to the solid state realm the powers of a vacuum tube thermal...
