Is there any way to simulate data flow through a circuit flow or in other words traffic passing through the board.
The thermal simulation are performed based on worst case power dissipation of the component from the data sheet. But in reality this is affected by the flow of data from one...
We have several designs using fiber filled plastics, which are injection molded. Our in-house FEA tool is ANSYS. What is the best way to be able to accurately simulate behavior of such parts?
Using isotropic datasheet properties in ANSYS doesn't seem to be the answer.
Any advice/feedback is...