comupter simulation of electroplating system
comupter simulation of electroplating system
(OP)
Anybody knows of any software packages that will model electroplating system?
books, or literatures on this subject will be highly helpful too. Thanks!
books, or literatures on this subject will be highly helpful too. Thanks!





RE: comupter simulation of electroplating system
Take a look at some of the books and suppliers listed at the sites I listed in Thread116-56926.
For more advanced modelling of electrodeposition processes, I recommend The Journal of the Electrochemical Society and the Monograph (book) Fundamentals of Electrochemical Deposition, by M. Paunovic and M. Schlesinger (1998); 301 pages, ISBN 0-471-16820-3.
available at
http://www.electrochem.org/publications/publications.htm
RE: comupter simulation of electroplating system
I should have been more specific about my question: Last year or so, I attended an AESF show where I saw there was this software package that modeling the electroplating system. Basically, it consists of simulations for primary, secondary, mixed current distruibutions in an electroplating cell (I believe it also has some info. on hydrodynamic influence) by solving the related PDEs -- I'm not sure what kind of algorithms they used for iteration (Gaussion or SOR). It has a graphic interface. Very nicely done. The only thing is that it is for educational or research purpose. The geometry of the cathode(translate: the part) is relatively simple -- rod, triangle, etc.
I just wonder whether there are more people out there doing this type of work, where the plating thickness of a part with more complicated configuration can be predicted as close as possible, and the toolings and solution parameters can be modified accordingly.
Thanks for your help!
PS. I have been looking through some articles in Journal of Electrochamical society. There is this work using MathLab to study the hydrodynamic effect on plating disks. My take is that softwares concerning CFD are easier to find than in our field.
RE: comupter simulation of electroplating system
The 'Nickel Plating' article from the MF Guidebook may be useful:
http://www.metalfinishing.com/WZ/MetalFinishing/guidebooks/MetalGB_ElectroplatingSolutions/000020/show/#TBLI
The vast majority of platers follow 'cookbook' recipes. The only 'research' is using a Hull plating cell to determine the effect of current density for a particular plating solution (the Hull cell has rectangular anode & cathodes placed at an angle, so that the current density varies from high at one end to low at the other). Some cells allow for heating or for an external pump to vary circulation.
The annual SUR/FIN show is in Milwaukee June 23-26 this year, so you can find any vendor there. Overall description is at
http://www.aesf.org/conferences/surfin.html
Exhibiting vendors are at
http://www.aesf.org/exhibit/sf03boothdesc.html
and last year's (2002) exhibitors are at
http://www.aesf.org/exhibit/sf02boothdesc.html
Note: the exhibitor listings are pretty vast, you can use your browser (Edit, Find on this page) to search for keywords like computer.
Good luck,
Ken
RE: comupter simulation of electroplating system
The L-Chem website is:
http://www.l-chem.com/index.htm
You can download a demo of the program from the website.
RE: comupter simulation of electroplating system
Yes! I think that is exactlly what I saw in SUR/FIN. I'm going this year again, so I will have a better look at it.
Thank you both, ken and djsugg
RE: comupter simulation of electroplating system
http://www.comsol.com/chem/