*Eng-Tips's functionality depends on members receiving e-mail. By joining you are opting in to receive e-mail.
Partner With Us!
"Best Of Breed" Forums Add Stickiness To Your Site
(Download This Button Today!)
Member Feedback
"...Just a quick note to say, "THANKS!" for these forums...The site is very well layed out and easy to use. Thanks for bringing us together - we need each other."
I would like to find out what procedures are in use to apply a flash electroplated finish of copper, tin or nickel to a nickel-chromium electrical resistance alloy. I'm told that this requires extremely harsh activation chemistry. What type of chemistry?
Henry Ford said "If you need a tool and do not buy it, you will pay for it anyway"
toolaholic There is a relatively new method called direct metalization which seeds a cunductive polymer to the hole to carry the electroplating current. This replaces the classical platinum seeding method.
Hi SethN Thanks for the reference. Direct Metallization is new to me. Can you suggest a place to go for more process data? Also, you mention a hole. What did I miss? Are you referring to a site on the cathode's topology where bonding will occur?
toolaholic
Henry Ford said "If you need a tool and do not buy it, you will pay for it anyway"
toolaholic I may have pointed you in the wrong direction, my apologies. Direct metalization is a process in printed circuit board fabrication. The technology may have other applications however. For an overview see: http://www.electrochemicals.com/tech1.htm#dm
Seth Normyle Process Engineer
Start A New Thread
Posting in the Eng-Tips forums is a member-only feature.
DESCRIPTION: Electronic material engineering technical support forum and mutual help system for engineering professionals. Selling and recruiting forbidden.
Electoplating copper or tin or nickel to NiChrome