Hot solder dip vs Tin-lead plate finish on Microcircuit
Hot solder dip vs Tin-lead plate finish on Microcircuit
(OP)
Currently using a microcircuit with tin-lead plate lead finish. We repair the circuit card and occasionally have to remove and replace faulty microcircuits. The microcircuit supplier wants to substitute same microcircuit, but with hot solder dip lead finish. Is there any problem with using a different lead finish?





RE: Hot solder dip vs Tin-lead plate finish on Microcircuit
RE: Hot solder dip vs Tin-lead plate finish on Microcircuit
RE: Hot solder dip vs Tin-lead plate finish on Microcircuit
When I worked on a hybrid manufacturing facility, not long out of university, most of the high temperature reflow work was in an inert (nitrogen) atmosphere, and the really awkward stuff was done in a reducing (hydrogen) atmosphere without flux. The latter needs special equipment and, yes, it is as expensive as you might think.