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Thermal Stress analysis in BGA package

Thermal Stress analysis in BGA package

Thermal Stress analysis in BGA package

(OP)
Hi,

I am doing Thermal stress analysis using python script on BGA package. My model contains PCB, solder ball, substrate, die attach, die and molding compound. Its a sequential stress analysis hence i did heat transfer followed by static stress analysis. In heat transfer analysis i am using user given Temperature and flux on the die surface as a condition, but i have 2 queries in boundary conditions.

1. How can i give Convection boundary condition(surface of the package)?
2. How can i calculate the internal heat generation by the package and need to use it as a condition?

Please any help/advice will be helpful..

Thank you

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