Material advice: low thermal conductivity, high melting point and machinable
Material advice: low thermal conductivity, high melting point and machinable
(OP)
I'm looking for a recommendation for a material to be used for soldering fixture. Material needs to have low thermal conductivity, ba able to withstand the heat and be machinable.





RE: Material advice: low thermal conductivity, high melting point and machinable
I think McMaster carries it and similar stuff from Cotronics.
Mike Halloran
Pembroke Pines, FL, USA
RE: Material advice: low thermal conductivity, high melting point and machinable
tom
Thomas J. Walz
Carbide Processors, Inc.
www.carbideprocessors.com
Good engineering starts with a Grainger Catalog.
RE: Material advice: low thermal conductivity, high melting point and machinable
Fused (sintered) amorphous boron nitride can be k = 3 W/m-K. Machines well with abrasive tools, though it's a bit brittle and weak, but it has lovely non-stick properties for braze/solder tooling. You can buy it in rods and plates from McMaster-Carr, amongst other sources.
Foamed silica (Space Shuttle heat shield tile material) is one of the lowest conductivity materials around (www.cotronics.com), k = .19 W/m-K. This stuff too is brittle and weak, but can be machined easily with abrasive bits (heck, with a pocketknife too). Also very low wettability to molten metals, fluxes, etc.
RE: Material advice: low thermal conductivity, high melting point and machinable