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Modeling of thermal expansion of flip chip

Modeling of thermal expansion of flip chip

Modeling of thermal expansion of flip chip

(OP)
Hi all,

I am new to Abaqus and I hope someone can help me with an issue.

Basically I am doing a 2D analysis of the flip chip undergoing thermal fatigue (-40 degrees C to 125 degrees C).

Below is the material property data that I want to input for my underfill.

CTE1: 37.15
CTE2: 117.8
Modulus @ 25 degree C = 5.291GPa
Modulus @ 200 degree C = 1.576GPa
Tg = 107.7
possion ratio = 0.35

CTE1 is the CTE below Tg while CTE2 is the CTE above Tg.

I am trying to model it as an elastic and homogenous material. But I am unsure of how to do it since it under elastic property, there isn't any option for me to put in my Tg.

Hope some kind soul can help me.

Thank you.

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