Circuit board assembly vibration analysis
Circuit board assembly vibration analysis
(OP)
I got this project to perform vibration analysis for an electronic equipment used in the aircraft. Inside this equipment, there are stacks of circuit board. These board has mix of surface mount as well as through hole components. The analysis will pin point if there is any problem in the circuit boards to meet the vibration requirement.
The question I have is if there is any general guideline to determine the allowable displacement for the circuit board to meet certain number of test hours.
I like to see how stress engineers deal with this type of analysis. Ideally, I would like to point to a generic spec (e.g Mil spec) in my analysis report.
If there is no such spec existed, does it mean I need to model all critical components and their joints to determine the stress level. (I hope this is not the case, as there are thousands of components on the boards and I can easily identified over 100 of them are in some higher risk area--the area subject to highest stress reversal).
I believe Steinberg got some equations to determine the acceptable natural frequency of the board. But the equation is for specific type of components and in specific spot in on the board. I am looking for a generic guideline for board with mix components.
The question I have is if there is any general guideline to determine the allowable displacement for the circuit board to meet certain number of test hours.
I like to see how stress engineers deal with this type of analysis. Ideally, I would like to point to a generic spec (e.g Mil spec) in my analysis report.
If there is no such spec existed, does it mean I need to model all critical components and their joints to determine the stress level. (I hope this is not the case, as there are thousands of components on the boards and I can easily identified over 100 of them are in some higher risk area--the area subject to highest stress reversal).
I believe Steinberg got some equations to determine the acceptable natural frequency of the board. But the equation is for specific type of components and in specific spot in on the board. I am looking for a generic guideline for board with mix components.





RE: Circuit board assembly vibration analysis
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RE: Circuit board assembly vibration analysis
Tobalcane
"If you avoid failure, you also avoid success."
“Luck is where preparation meets opportunity”
RE: Circuit board assembly vibration analysis
As written in my original thread, Steingberg's calculation is mainly based on specific component type and board. My challenge is for high complexity board with many components. The question will remain, under certain vibration environment with given physical data (e.g. board size, thickness, component, mounting configuration....etc) what will be the criteria to determine if the board is at risk of failure without modeling each individual components before prototypes are made.
Mil-STD 810 is an environmental test spec. I couldn't remember seeing the kind of information I am looking for.
RE: Circuit board assembly vibration analysis
Tobalcane
"If you avoid failure, you also avoid success."
“Luck is where preparation meets opportunity”
RE: Circuit board assembly vibration analysis
RE: Circuit board assembly vibration analysis
Tobalcane
"If you avoid failure, you also avoid success."
“Luck is where preparation meets opportunity”
RE: Circuit board assembly vibration analysis
RE: Circuit board assembly vibration analysis
Tobalcane
"If you avoid failure, you also avoid success."
“Luck is where preparation meets opportunity”