Gold embrittlement in Tin solder joints
Gold embrittlement in Tin solder joints
(OP)
Since my infancy as a new engineer I have been taught about the gold embrittlement issues related to tin-lead solders, specifically 63/37 alloy. It has been my understandng that the problem is associated with gold percentages above 3% weight and its intermetallic formation with lead. To avoid this issue altogether I have often specified the use of Tin-Silver (Sn96) instead of the Tin-Lead when joining gold plated components, without a pre-tinning process. Recently this approach has come into question and a so called "expert" has said that the issue is the gold forming intermetallics with the tin, not the lead. Now I know that one of the most popular and historically reliable solders used in microelctronic assembly is gold-tin (Au/Sn 80/20). My logic tells me that if gold and tin had a problem with each other there would be no way this solder would stand the test of time, so I am crying Bull... on the so called "expert". Can anyone provide some relavant testimony or insight?





RE: Gold embrittlement in Tin solder joints
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If we learn from our mistakes I'm getting a great education!
RE: Gold embrittlement in Tin solder joints
www.semlab.com/goldembrittlementofsolderjoints.pdf
RE: Gold embrittlement in Tin solder joints
RE: Gold embrittlement in Tin solder joints
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If we learn from our mistakes I'm getting a great education!
RE: Gold embrittlement in Tin solder joints
RE: Gold embrittlement in Tin solder joints
----------------------------------
If we learn from our mistakes I'm getting a great education!
RE: Gold embrittlement in Tin solder joints