IC package cross-compatibility
IC package cross-compatibility
(OP)
Hello all,
I have been a circuit designer for several years, and one thing I have not understood is why there are so many different names for the same IC package? For example, it seems to me that SOT-23 is the same as TO-263-3 or SC-59-3. When I try to design a circuit using, say, a mosfet, in this package, I need to know which manufacturers make a compatible device. But many different names exist for a device package which all fit the same footprint. Does anyone know of a chart or table or list or any way to know if one manufacturer's device package name will be compatible with another's??? I can look at the datasheets and compare, but when I am looking for a discreet component, I need to be able to search by the package type... so therefore I need to know which package types are compatible!
I hope you can help,
B
I have been a circuit designer for several years, and one thing I have not understood is why there are so many different names for the same IC package? For example, it seems to me that SOT-23 is the same as TO-263-3 or SC-59-3. When I try to design a circuit using, say, a mosfet, in this package, I need to know which manufacturers make a compatible device. But many different names exist for a device package which all fit the same footprint. Does anyone know of a chart or table or list or any way to know if one manufacturer's device package name will be compatible with another's??? I can look at the datasheets and compare, but when I am looking for a discreet component, I need to be able to search by the package type... so therefore I need to know which package types are compatible!
I hope you can help,
B





RE: IC package cross-compatibility
My best technique has been working through a distributor site, like DigiKey. At least there you can sort by package and see multiple manufacturers.
John D
RE: IC package cross-compatibility
B
RE: IC package cross-compatibility
Mike Halloran
Pembroke Pines, FL, USA
RE: IC package cross-compatibility
B
RE: IC package cross-compatibility
John D