Vibration of printed wiring boards (Circuit Card Assemblies)
Vibration of printed wiring boards (Circuit Card Assemblies)
(OP)
This covers the vibration of circuit card assemblies (printed wiring boards) located in electronic chassis. The boards are manufactuared using FR-4/Glass epoxy material.
I am looking for the following information.
1) material properties (modulus of elasticity, thermal conductivity, poisson's ratio) of FR-4 ?
2)any hand calculations that can be used to approximately calculate or quickly verify FEA analysis.
3)any technical paper/publications that provide the above information.
Need the information ASAP. Thank you.
I am looking for the following information.
1) material properties (modulus of elasticity, thermal conductivity, poisson's ratio) of FR-4 ?
2)any hand calculations that can be used to approximately calculate or quickly verify FEA analysis.
3)any technical paper/publications that provide the above information.
Need the information ASAP. Thank you.





RE: Vibration of printed wiring boards (Circuit Card Assemblies)
Dave Steinberg, Vibration Analysis for Electronic Equipment, Wiley-Interscience, New York, 1988.
In addition, I have posted some related software and tutorials at:
http://www.vibrationdata.com
Sincerely, Tom Irvine