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ink adhesion standard

ink adhesion standard

ink adhesion standard

(OP)
I need to clean up/add some specifications on molded parts that get printed either via pad printing or silk screening.  Is ASTM F1842-02 the best standard to reference in my specification or is there some other standard that people have found to be better?  I'm located in the US.

RE: ink adhesion standard

ASTM D3359 - 08 Standard Test Methods for Measuring Adhesion by Tape Test (specifically called out for metal substrates but has a section on platic)

or maybe ISO 2409:2007
 

RE: ink adhesion standard

(OP)
mcgyvr,

I don't have access to any of these standards at the moment and am looking to purchase the most relevant.  I first found D3359, but this quote on the ASTM website made me think F1842 would be better:

Quote:

1. Scope

1.1 This test method is based on existing Test Method D3359, with modifications to make it suitable for plastic substrates and membrane switches.

Have you found D3359 to be more relevant?

RE: ink adhesion standard

I don't have either but have called out these in the past.

IPC TM-650 2.4.1 Adhesion, Tape Testing on printed circuit boards

ASTM F1842-97 for plastic substrate

ASTM D3359-97 for metallic substrate

ASTM F2252-03 Flexible packaging materials

MIL-P-55110 for printed circuit boards.

Looks like F1842 is your best bet

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