Modal analysis after contact
Modal analysis after contact
(OP)
Dear All,
I am running an analysis where two surfaces contact, then are bonded on contact. This seems to be perfectly possible in Ansys. What I would then like to do is run a modal analysis on the bonded assembly, by a restart. Does anyone know if it is possible or impossible to do this? I have a suspicion that it might not be possible... :S
Thanks
Will
I am running an analysis where two surfaces contact, then are bonded on contact. This seems to be perfectly possible in Ansys. What I would then like to do is run a modal analysis on the bonded assembly, by a restart. Does anyone know if it is possible or impossible to do this? I have a suspicion that it might not be possible... :S
Thanks
Will





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RE: Modal analysis after contact