Flexible Circuit Bonding methods
Flexible Circuit Bonding methods
(OP)
I have two flexible circuit materials - Polyimide (PI), and Polyethylene Terephalate (PET). I need to bond a thin metal tab to flexible circuit pads on each of these substrates. I have 4 different methods of bonding:
1. Solder
2. Ultrasonic welding
3. Laser welding
4. ICF/ACF (Isotropic conductive film/Anisotropic conductive film). This method is used for bonding LCD displays to rigid and flexible circuits.
Does anyone have experience with these bonding methods and what is preferential? The PET has a melt point around 200-255 deg C so I already know that this will not work with soldering. In contrast PI has a melt temperature around 352-388 deg C.
-loudig
1. Solder
2. Ultrasonic welding
3. Laser welding
4. ICF/ACF (Isotropic conductive film/Anisotropic conductive film). This method is used for bonding LCD displays to rigid and flexible circuits.
Does anyone have experience with these bonding methods and what is preferential? The PET has a melt point around 200-255 deg C so I already know that this will not work with soldering. In contrast PI has a melt temperature around 352-388 deg C.
-loudig





RE: Flexible Circuit Bonding methods
You are not stating anything about size, ..and what about gluing?
RE: Flexible Circuit Bonding methods
RE: Flexible Circuit Bonding methods
http://www.aitechnology.com/
http://www.promatech.co.uk/
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If we learn from our mistakes I'm getting a great education!
RE: Flexible Circuit Bonding methods
I will soon have responsibility to do something very similar, improving existing methods. Current method is combination soldering and application of small amount of conductive epoxy to improve pull-strength and retention. I won't be able to get on this project until early next year, but I would very much like to monitor your investigation and results.
TygerDawg
Blue Technik LLC
Virtuoso Robotics Engineering
www.bluetechnik.com
RE: Flexible Circuit Bonding methods
tygerdawg - I'll be sure to keep you informed of what I decide to do with our bond method and material type!
-loudig