Alumina Substrate bonding to gold fingers of a connector
Alumina Substrate bonding to gold fingers of a connector
(OP)
Hello,
We are using a card edge type of connector, with ni\au on the contact surfaces. We are plugging a ceramic board with gold fingers into it. When we remove the ceramic board the pins of the connector are coming out with it. Is there some sort of chemical bond that can take place between these to materials? We have tried normal FR boards, and have not had the problem, only with the ceramic.
Your thoughts and help on this are appreciated.
Thank you.
We are using a card edge type of connector, with ni\au on the contact surfaces. We are plugging a ceramic board with gold fingers into it. When we remove the ceramic board the pins of the connector are coming out with it. Is there some sort of chemical bond that can take place between these to materials? We have tried normal FR boards, and have not had the problem, only with the ceramic.
Your thoughts and help on this are appreciated.
Thank you.





RE: Alumina Substrate bonding to gold fingers of a connector
RE: Alumina Substrate bonding to gold fingers of a connector
RE: Alumina Substrate bonding to gold fingers of a connector
Actually, if anyone knows of a definition that describes the difference between brazing and soldering while encompassing 'active braze alloys', I would appreciate seeing it.
tom
Thomas J. Walz
Carbide Processors, Inc.
www.carbideprocessors.com
Good engineering starts with a Grainger Catalog.
RE: Alumina Substrate bonding to gold fingers of a connector
Look for 450C as the demarcation line. I've seen this number in several papers. After reading the AZOM article you might want to get the original article in Materials World.
Here is the Azom paper.
http://www.azom.com/Details.asp?ArticleID=1079
Here is the original paper.
Source: Materials World, Vol. 7, no. 11, pp. 686-88 November 1999.
Primary author: Dr. John A Fernie and Dr. Kane I Ironside
You can get it here for very reasonable price.
http://www.lindahall.org/
RE: Alumina Substrate bonding to gold fingers of a connector