Thermal Stress
Thermal Stress
(OP)
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RE: Thermal Stress
I have not used anything else with SolidWorks other than COSMOS. http
Chris
SolidWorks/PDMWorks 08 3.1
AutoCAD 06/08
ctopher's home (updated Jul 13, 2008)
RE: Thermal Stress
SolidWorks will output so many different file formats that can be read back in by a variety of software packages. Are you looking for the more automated integration from something like NEiWorks or Algor? Or are you willing to export as an IGES file and read it in to an outside solver?
RE: Thermal Stress
Joe Hasik, CSWP/SMTL
SW 08 x64, SP 4.0
SW 09 x64, BETA 1
Dell T3400
Intel Core2 Quad
Q6700 2.66 GHz
3.93 GB RAM
NVIDIA Quadro FX 4600
RE: Thermal Stress
In the category of COSMOS, I generally throw Algor (integrated or variety of file import formats), NENastran (integrated or variety of import file formats), and AMPS (uses the .sat file format - ACIS kernal exportable from SW). Any one of these should work for thermal stress, but COSMOS should do the trick, too, so why are you turning away from COSMOS?
RE: Thermal Stress
Chris
SolidWorks/PDMWorks 08 3.1
AutoCAD 06/08
ctopher's home (updated Jul 13, 2008)
RE: Thermal Stress
Chris - Got my quote from my VAR about ten minutes ago. Including the subscription fee it would cost me about $8000 to tack COSMOS Professional on to my current SW Premium license.
Joe Hasik, CSWP/SMTL
SW 08 x64, SP 4.0
SW 09 x64, BETA 1
Dell T3400
Intel Core2 Quad
Q6700 2.66 GHz
3.93 GB RAM
NVIDIA Quadro FX 4600
RE: Thermal Stress
Chris
SolidWorks/PDMWorks 08 3.1
AutoCAD 06/08
ctopher's home (updated Jul 13, 2008)
RE: Thermal Stress
For FEA embedded in SW, I say stick with the COSMOS path...and I'm not a big COSMOS fan (due primarily to lack of experience with it and my disdain for COSMOS Express that I think is dangerous).
RE: Thermal Stress
Chris,
I'd love to remove my subscription fees, but as a company and department we've gotten a little too well known for trying to stay on the cutting edge of technology. Besides, take away the fees and I won't have any expenses to approve anymore.
Joe Hasik, CSWP/SMTL
SW 08 x64, SP 4.0
SW 09 x64, BETA 1
Dell T3400
Intel Core2 Quad
Q6700 2.66 GHz
3.93 GB RAM
NVIDIA Quadro FX 4600
RE: Thermal Stress
RE: Thermal Stress
1. It solves outside of SW so on a long problem you can continue with CAD.
2. It creates a text file with a record of the whole analysis so you have an unchangeable document of what you did. In other words you are better insulated from changing things in SW after the analysis is over.
3. It's FEA model whether thermal or stress will directly translate into it's big brother Pre/Post processor FEMAP and into NENastran should you grow out of the integrated system.
So you have the advantages of quick model setup in SW with some additional advantages to boot.
There is also a Nastran forum on Eng-Tips with some real experts from time to time.
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