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Lead-free solder process

Lead-free solder process

Lead-free solder process

(OP)
Lead-free solder process or alternate process such as epoxy for applications (above 200 °C).

Must be lead-free

Must be suitable for temperature applications 200 - 250 °C

Types of materials to be soldered:
Must be compatible with ceramics and passive devices on polyimide PCB and MCM substrates

Compatibility with plastic packaging would also be of interest

Durability:
1 year at 200 °C (or more) steady state (no thermal cycles, few mechanical shocks)
1000 hours at 200 °C (or more) with thermal cycles and many mechanical shocks

Technologies should be adaptable for low and high power boards

Thomas J. Walz
Carbide Processors, Inc.
www.carbideprocessors.com

RE: Lead-free solder process

Tom,
Are you offering these processes or you are listing the latest soldering technologies available on the market? Are you out to buy new soldering processes or listing the topics of your thesis for graduation? Give us a hint, if it is free.
gr2vessels

RE: Lead-free solder process

(OP)
Sorry - I have an RFQ I am considering.   Customer wants a product that meets those specifications.  Wants it in approved and in place before 2010.  

Overall the customer wants the best way to eliminate current lead containing solders for electronics manufacture.   

Posted here to see if anyone had anything new.   Ideally something better than is currently on the NIST list.    http://www.boulder.nist.gov/div853/lead%20free/props01.html

Tom


Thomas J. Walz
Carbide Processors, Inc.
www.carbideprocessors.com

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