PCB bubbling durning reflow soldering
PCB bubbling durning reflow soldering
(OP)
The company I work for has been experiencing problems with bubbles forming between layers in our Printed Circut Boards. The bubbles have caused traces to break and pull away from pads and vias. The problem only occures after or during the population of the surface mount components. I would greatly appreciate any ideas about what may be causing this and possible ways to prevent it. Thank you all in advance.
Shooter
Shooter





RE: PCB bubbling durning reflow soldering
Overtemp or too long in the reflow oven?
RE: PCB bubbling durning reflow soldering
I've had the problem twice. Both times the PCB manufacturer would not admit their problem and I had to switch suppliers.
This is not caused by anything you have done. FR-4 is epoxy-glass and it does not absorbe air or water. Epoxy-glass is used to make surfboards and boats.
RE: PCB bubbling durning reflow soldering
RE: PCB bubbling durning reflow soldering
RE: PCB bubbling durning reflow soldering
RE: PCB bubbling durning reflow soldering
You need to investigate exactly what laminate your PCB house is using, and check the specifications. Go to the actual laminate web sites for data sheets. I listed the RoHs laminate manufacturers in thread240-151146: Halogen-free FR4 and RoHS . If your PCB house does not have an actual process problem, you may have to carefully specify the laminate.
In the pre-RoHS era, for most board designs you might-of just specified "FR-4" and not paid any more attention. With the higher process temperatures required for RoHs solders, and possible longer dwell times (for solder wetting), the laminate material frequently needs additional closer specification. This situation will probably continue for a few years until the various new materials shake-out and a particular new material formulation becomes popular and generally accepted. A similar situation happened in the early FR-4 era.
RE: PCB bubbling durning reflow soldering
RE: PCB bubbling durning reflow soldering
RE: PCB bubbling durning reflow soldering
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