Manufacuring Thermionic Power Chips
Manufacuring Thermionic Power Chips
(OP)
Hello,
I'm new to this board, but I'd like to get some verification on an idea I'm working on.
In 2001, Eneco, a company owned and operated by Professors at MIT, delivered their "Power Chip", a semiconductor structure that delivers to the solid state realm the powers of a vacuum tube thermal diode.
However, their packaging technique has limited their ability to market the device. In the following 5 years, they still have not managed to make progress in this field.
I believe I may have found a solution to their manufacturing trouble, but I need verification from outside sources.
My idea is fairly basic. I want to rotate the diode interconnect assembly 90 degrees to bring it parallel to the substrate. This should make the process much easier to develop. Right now the device requires a laminating technique where the junctions are perpendicular to the substrate, which is very difficult to manufacture on such as small scale. I've included a couple pictures of broken open TECs (which use a perpendicular diode array manufacturing technique) as well as some lego designs of the new arrangement for visualization purposes. Please note that the final device would operate perpendicular to the heat source.
Please check out the images at http://morlock.newdor.com/
Thank you for your time.
I'm new to this board, but I'd like to get some verification on an idea I'm working on.
In 2001, Eneco, a company owned and operated by Professors at MIT, delivered their "Power Chip", a semiconductor structure that delivers to the solid state realm the powers of a vacuum tube thermal diode.
However, their packaging technique has limited their ability to market the device. In the following 5 years, they still have not managed to make progress in this field.
I believe I may have found a solution to their manufacturing trouble, but I need verification from outside sources.
My idea is fairly basic. I want to rotate the diode interconnect assembly 90 degrees to bring it parallel to the substrate. This should make the process much easier to develop. Right now the device requires a laminating technique where the junctions are perpendicular to the substrate, which is very difficult to manufacture on such as small scale. I've included a couple pictures of broken open TECs (which use a perpendicular diode array manufacturing technique) as well as some lego designs of the new arrangement for visualization purposes. Please note that the final device would operate perpendicular to the heat source.
Please check out the images at http://morlock.newdor.com/
Thank you for your time.





RE: Manufacuring Thermionic Power Chips
TTFN
RE: Manufacuring Thermionic Power Chips
Why not use In-Sb Peltier elements?
Plesae read FAQ240-1032
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RE: Manufacuring Thermionic Power Chips
However, the devices operate on the same general principles as the standard TE device, i.e., the current flow itself moves the heat. That makes putting the hot and cold surfaces parallel to the current flow a non-starter
TTFN
RE: Manufacuring Thermionic Power Chips
I understood that the evolution of heat took place at the junction interconnects, not really inside the junction itself.
As for the hot and cold surfaces, they're still there, just dealing with hot and cold edges now instead.
RE: Manufacuring Thermionic Power Chips
The internal design of each diode prevents return flow, but the heat evolves into a hot carrier electron or hot carrier hole at the interconnect as it begins to traverse the semiconductor.
Which means that in this design heat flow would still be running in parallel to the current flow, just perpendicular to the substrate.
RE: Manufacuring Thermionic Power Chips
TTFN
RE: Manufacuring Thermionic Power Chips
It's designed to cool to room temperature.
Until that point, the thermal flow is always downhill.