Circuit board pad layout.
Circuit board pad layout.
(OP)
What are the possible manufacturing issues and drawbacks involved in using a pad layout that is exactly the same dimensions as the
maximum tolerance of the footprint of the device being installed? Can I get away with having a 7% overhang of the interior "heel" of the surface mount part relative to the pad? Why should I follow an IPC recomended pad layout that takes up so much of my board space when the device will fit snug on a smaller layout?
maximum tolerance of the footprint of the device being installed? Can I get away with having a 7% overhang of the interior "heel" of the surface mount part relative to the pad? Why should I follow an IPC recomended pad layout that takes up so much of my board space when the device will fit snug on a smaller layout?





RE: Circuit board pad layout.