solder pad design issues
solder pad design issues
(OP)
Hi all,
I have a new project that the new component which it's two leads are so close to each other, gap between leads is only 0.25+/-0.05 mm.
So if I were to make a gap of 0.2mm between two solder pads, is this doable by PCB maker? or can I make this side of the pad shorter than the lead (so the gap between the two pads are bigger) while the other three sides are as per normal?
The component is very tiny and measures only 1.1x3.4mm, what would be the recommended solder paste thickness?
many thanks!
I have a new project that the new component which it's two leads are so close to each other, gap between leads is only 0.25+/-0.05 mm.
So if I were to make a gap of 0.2mm between two solder pads, is this doable by PCB maker? or can I make this side of the pad shorter than the lead (so the gap between the two pads are bigger) while the other three sides are as per normal?
The component is very tiny and measures only 1.1x3.4mm, what would be the recommended solder paste thickness?
many thanks!
Best regards,
ct





RE: solder pad design issues
TTFN
RE: solder pad design issues
Off hand, I don't think that .2mm (~.008") shouldn't be too bad. I did a quick check of the last board I did, which uses a F2812 processor. The pad - pad clearance of that device is only about 0.19mm with .3mm for the pad width.
Also be aware that sometimes while it is possible to successfully produce ultra-fine spacings, there can be a significant cost adder to do so. I believe the PCB manufacturer I use charges extra when you smaller than .005" (.127mm)