Quick Question - BGA packages and pcb's
Quick Question - BGA packages and pcb's
(OP)
Hello all- I am considering using a BGA packaged module for the first time and was wondering if any of you guys had any experience with making the pcb's for these. It is an 11x11 array with 2.5mm spacing. The other option for the module is a surface mount board-to-board connector, but it is slightly larger.
Would it be difficult to design and route the PCB using a 2 layer board (PCBexpress)? Only about 50% of the pins would be used, but it seems to me there could be issues with routing.
Is the manufacturing/reflow process unreliable or overly expensive for small qty (<100)?
Any other comments and suggestions are welcome.
Thanks,
Would it be difficult to design and route the PCB using a 2 layer board (PCBexpress)? Only about 50% of the pins would be used, but it seems to me there could be issues with routing.
Is the manufacturing/reflow process unreliable or overly expensive for small qty (<100)?
Any other comments and suggestions are welcome.
Thanks,





RE: Quick Question - BGA packages and pcb's
But to the point, they aren't trivial but can be done. Generally you would want ground and power planes.
If this is a programmable part you want to assign the pins not let the compiler do it. You want to put all the pins you use on the outer two rows if possible. You will need 40mil vias.
Suggestion. Buy a BGA to pin socket adapter, solder in the socket, then you can just drop in the BGA no soldering and change it at will.
Keith Cress
Flamin Systems, Inc.- http://www.flaminsystems.com
RE: Quick Question - BGA packages and pcb's
RE: Quick Question - BGA packages and pcb's
http://www.1800adapter.com/
Keith Cress
Flamin Systems, Inc.- http://www.flaminsystems.com
RE: Quick Question - BGA packages and pcb's
If you have good volumes, this may be a different story.Still, your test procedure will need to have what it takes to properly determine if the part has a problem or not. JTAG is in many cases the best, if not the only way to test BGA-based designs.
2.5mm spacing between balls is quite generous, so manufacturing shouldn't be too difficult. The manufacturer might even have a pad size and trace layout guideline for its product. You said a 11 x 11 grid, but I guess that the center has no balls. How many rows of balls ar there? His will determine how difficult your layout will be.
RE: Quick Question - BGA packages and pcb's
Thanks.
RE: Quick Question - BGA packages and pcb's
Mike Halloran
Pembroke Pines, FL, USA
RE: Quick Question - BGA packages and pcb's
Keith Cress
Flamin Systems, Inc.- http://www.flaminsystems.com
RE: Quick Question - BGA packages and pcb's