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modal analysis with damping

modal analysis with damping

modal analysis with damping

(OP)
I am doing an modal analysis on a circuit board that sits on a gap pad.  This gap pad is designed to dampen vibration and also produce sufficient conduction to cool the board.  It seems that applying a sping to the board is a logical way to represent this, yet I do not see a suface to surface option for setting up a spring.  Can I use the Spring to point option then use a offset point as my point with the surface being the underside of the card?  I can specify a different spring constant for each direction.  Because I the gap pad will only really respond in one direction I will just specify that spring constant component.  Does this sound like a correct approach?

Thanks,

Dane

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